WLI

Surface of Glass Substrates

Glass substrates are emerging as an important platform for advanced packaging and redistribution layers, driven by their combination of low coefficient of thermal expansion, excellent surface flatness, and low dielectric …

WLI

Surface Profiles of IC Packages

Wafer level packaging (WLP) pushes interconnect density and form factor to their limits, but it also pushes metrology to its limits. Inspection of bump height, redistribution layer (RDL) step heights, …