Voids in Bonded Substrates
Wafer bonding is a critical process step in advanced semiconductor manufacturing. It is used to join two wafers face-to-face to create stacked structures for 3D integration, MEMS packaging, power devices, …
Full Wafer Thin Film Measurements
Thin film layers are the foundation of every modern semiconductor device. Controlling the thickness and uniformity of these films across the entire wafer is critical because even nanometre-scale variations translate …
Thin Film Thickness Measurements in Etched Structures
lineWLI’s measurement capabilities go beyond just height information. The device can also measure the thickness of transparent thin films. This posts revisits a sample from a previous post. In the …
Profile of GaN Die Edge
11:22 AM Wafer dicing is the process of separating a finished semiconductor wafer into individual dies. While it appears straightforward compared to the complexity of front-end fabrication, it is a …