Dry etching is one of the most critical process steps in semiconductor fabrication, used to transfer circuit patterns from photoresist into the underlying material layers such as silicon dioxide, silicon …
Backgrinding reduces silicon wafers to the thickness required for advanced packaging. However, the grinding process leaves a damaged surface layer whose roughness directly determines die strength, downstream bonding yield, and …
Sample: A polka dot beam splitter (Thorlabs’ BPD254-FS) consists of 100 µm large metallic squares on top of a glass substrate. lineWLI technology measures the profile of one line in …
